{"title":"Historic Armies And Navies","description":null,"products":[{"product_id":"army-of-frederick-the-great-book-christopher-duffy-9780882542775","title":"The Army of Frederick the Great","description":"\u003cp\u003eThree-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. \u003c\/p\u003e\u003cb\u003e \u003c\/b\u003e\u003cp\u003eDesign of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: \u003c\/p\u003e \u003cul\u003e \u003cli\u003eIllustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer\u003c\/li\u003e \u003cli\u003eDiscusses the use of interposer technology and the role of Through-Silicon Vias (TSVs)\u003c\/li\u003e \u003cli\u003ePresents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs)\u003c\/li\u003e \u003cli\u003eExplores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications\u003c\/li\u003e \u003cli\u003eDescribes large-scale integration testing and state-of-the-art low-power testing solutions\u003c\/li\u003e\n\u003c\/ul\u003e \u003cp\u003eComplete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal-oxide-semiconductor (CMOS) integration for 3D integrated circuits (ICs), \u003cb\u003e Design of 3D Integrated Circuits and Systems \u003c\/b\u003eis a practical reference that\u003cb\u003e \u003c\/b\u003enot only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.\u003c\/p\u003e","brand":"WoB","offers":[{"title":"US \/ GOOD \/ SBYB","offer_id":49891654041873,"sku":"CIN088254277XG","price":0.0,"currency_code":"GBP","in_stock":false},{"title":"GB \/ VERY_GOOD \/ INTERNAL","offer_id":50332297494801,"sku":"GOR013930505","price":0.0,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0784\/4072\/6801\/files\/088254277X.jpg?v=1751171425"}],"url":"https:\/\/www.worldofbooks.com\/collections\/historic-armies-and-navies-book-series.oembed","provider":"World of Books ","version":"1.0","type":"link"}