{"title":"Materials And Processes For Electronic Applications","description":null,"products":[{"product_id":"adhesives-technology-for-electronic-applications-book-james-j-licari-9780815515135","title":"Adhesives Technology for Electronic Applications","description":"This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.","brand":"WoB","offers":[{"title":"US \/ WELL_READ \/ SBYB","offer_id":50362546258193,"sku":"CIN0815515138A","price":0.0,"currency_code":"GBP","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0784\/4072\/6801\/files\/0815515138.jpg?v=1751170867"},{"product_id":"adhesives-technology-for-electronic-applications-book-james-j-licari-9780128103708","title":"Adhesives Technology for Electronic Applications","description":"Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.  The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike.  The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.  As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as:     Tamper-proof adhesives for electronic security devices Bio-compatible adhesives for implantable medical devices Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market) Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices.","brand":"WoB","offers":[{"title":"GB \/ NEW \/ INGRAM","offer_id":52583997374737,"sku":"NLS9780128103708","price":0.0,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0784\/4072\/6801\/files\/9780128103708.jpg?v=1761048701"},{"product_id":"encapsulation-technologies-for-electronic-applications-book-haleh-ardebili-9780128119785","title":"Encapsulation Technologies for Electronic Applications","description":"Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages.     In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology.    Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.","brand":"WoB","offers":[{"title":"GB \/ NEW \/ INGRAM","offer_id":52657094852881,"sku":"NLS9780128119785","price":0.0,"currency_code":"GBP","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0784\/4072\/6801\/files\/9780128119785.jpg?v=1762227152"}],"url":"https:\/\/www.worldofbooks.com\/collections\/materials-and-processes-for-electronic-applications-book-series.oembed","provider":"World of Books ","version":"1.0","type":"link"}