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Thermal Stress and Strain in Microelectronics Packaging

Thermal Stress and Strain in Microelectronics Packaging

Author: John Lau

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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Author: John Lau

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Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Author: John Lau

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3D IC Integration and Packaging

3D IC Integration and Packaging

Author: John Lau

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Basics Fashion Design 09: Designing Accessories

Basics Fashion Design 09: Designing Accessories

Author: John Lau

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Through-Silicon Vias for 3D Integration

Through-Silicon Vias for 3D Integration

Author: John Lau

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

Author: John Lau

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BALL GRID ARRAY TECHNOLOGY

BALL GRID ARRAY TECHNOLOGY

Author: John Lau

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Flip Chip Technologies

Flip Chip Technologies

Author: John Lau

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