Chemical-Mechanical Polishing Fundamentals and Challenges: Volume 566

Chemical-Mechanical Polishing Fundamentals and Challenges: Volume 566 by S V Babu

Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the semiconductor industry towards smaller, faster and less expensive interconnects. However, there are still many gaps in the fundamental understanding of the overall CMP process and the associated defect and contamination issues. This book brings together many of the active players in the field to focus on the interdisciplinary nature of these challenges. It reflects, to some extent, the role played by both academic institutions and multinational corporations in opening up the frontiers in the field of CMP for wider dissemination. Both experimental and theoretical contributions are included. Topics include: overview and oxide polishing; pads and related issues; metal polishing - W and Al; copper polishing and related issues; CMP modeling and fluid flow; and particle adhesion and post-polish cleaning.

SKU	Nicht verfügbar
ISBN 13	9781558994737
ISBN 10	1558994734
Titel	Chemical-Mechanical Polishing Fundamentals and Challenges: Volume 566
Autor	S V Babu
Serie	Mrs Proceedings
Buchzustand	Nicht verfügbar
Bindungsart	Hardback
Verlag	Materials Research Society
Erscheinungsjahr	2000-02-10
Seitenanzahl	281
Hinweis auf dem Einband	Die Abbildung des Buches dient nur Illustrationszwecken, die tatsächliche Bindung, das Cover und die Auflage können sich davon unterscheiden.
Hinweis	Nicht verfügbar