Electronic Packaging Materials and Their Properties by Michael Pecht

Electronic Packaging Materials and Their Properties by Michael Pecht

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Michael Pecht, Rakish Agarwal, F. Patrick McCluskey, Terrance J. Dishongh, Sirus Javadpour, Rahul Mahajan

SKU	Nicht verfügbar
ISBN 13	9780849396250
ISBN 10	0849396255
Titel	Electronic Packaging Materials and Their Properties
Autor	Michael Pecht
Serie	Electronic Packaging
Buchzustand	Nicht verfügbar
Verlag	Taylor & Francis Inc
Erscheinungsjahr	1998-12-18
Seitenanzahl	120
Hinweis auf dem Einband	Die Abbildung des Buches dient nur Illustrationszwecken, die tatsächliche Bindung, das Cover und die Auflage können sich davon unterscheiden.
Hinweis	Nicht verfügbar