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3D Integration for NoC-based SoC Architectures Abbas Sheibanyrad

3D Integration for NoC-based SoC Architectures By Abbas Sheibanyrad

3D Integration for NoC-based SoC Architectures by Abbas Sheibanyrad


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Summary

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs.

3D Integration for NoC-based SoC Architectures Summary

3D Integration for NoC-based SoC Architectures by Abbas Sheibanyrad

This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.

Table of Contents

Three-Dimensional Integration of Integrated Circuits - an Introduction.- The Promises and Limitation of 3-D Integration.- Testing 3D Stacked ICs Containing Through-Silicon Vias.- Design and Computer Aided Design of 3DIC.- Physical Analysis of NoC Topologies for 3-D Integrated Systems.- Three-Dimensional Networks-on-Chip: Performance Evaluation.- Asynchronous 3D-NoCs.- Design of Application-Specific 3D Networks-on-Chip Architectures.- 3D Network on Chip Topology Synthesis: Designing Custom Topologies for Chip Stacks.- 3-D NoC on Inductive Wireless Interconnect.- Influence of Stacked 3D Memory/Cache architectures on GPUs.

Additional information

NLS9781461427483
9781461427483
1461427487
3D Integration for NoC-based SoC Architectures by Abbas Sheibanyrad
New
Paperback
Springer-Verlag New York Inc.
2012-12-27
278
N/A
Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
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