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Advanced Analysis of Nontraditional Machining By Hong Hocheng

Advanced Analysis of Nontraditional Machining by Hong Hocheng

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Summary

This book also documents the latest and frequently cited research results of a few key nonconventional machining processes for the most concerned topics in industrial applications, such as laser machining, electrical discharge machining, electropolishing of die and mold, and wafer processing for integrated circuit manufacturing.

This book will be specially printed for your order, which means it may take a little longer to arrive (5 days). We do this to cut down on waste & to help protect our planet.

Advanced Analysis of Nontraditional Machining Summary

Advanced Analysis of Nontraditional Machining by Hong Hocheng

Nontraditional machining utilizes thermal, chemical, electrical, mechanical and optimal sources of energy to bind, form and cut materials. Advanced Analysis of Nontraditional Machining explains in-depth how each of these advanced machining processes work, their machining system components, and process variables and industrial applications, thereby offering advanced knowledge and scientific insight. This book also documents the latest and frequently cited research results of a few key nonconventional machining processes for the most concerned topics in industrial applications, such as laser machining, electrical discharge machining, electropolishing of die and mold, and wafer processing for integrated circuit manufacturing.

About Hong Hocheng

Hong Hocheng, National Tsing Hua University, hocheng@pme.nthu.edu.tw

Hung-Yin Tsai, National Tsing Hua University, hytsai@pme.nthu.edu.tw

Table of Contents

Laser Machining and Its Associated Effects.- Electrical Discharge Machining.- Electrochemical Machining.- Chemical Mechanical Polishing.- Ultrasonic Machining.- Water Jet Machining.- Micromachining by Photonic Beams.- Material Shaping by Ion and Electron Nanobeams.

Additional information

NLS9781489995438
9781489995438
1489995439
Advanced Analysis of Nontraditional Machining by Hong Hocheng
New
Paperback
Springer-Verlag New York Inc.
2015-01-28
504
N/A
Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
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