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Chemical-Mechanical Planarization of Semiconductor Materials By M.R. Oliver

Chemical-Mechanical Planarization of Semiconductor Materials by M.R. Oliver

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Summary

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

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Chemical-Mechanical Planarization of Semiconductor Materials Summary

Chemical-Mechanical Planarization of Semiconductor Materials by M.R. Oliver

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Table of Contents

1 Introduction.- 2 CMP Technology.- 3 Metal Polishing Processes.- 4 Metal CMP Science.- 5 Equipment Used in CMP Processes.- 6 CMP Polishing Pads.- 7 Fundamentals of CMP Slurry.- 8 CMP Cleaning.- 9 Patterned Wafer Effects.- 10 Integration Issues of CMP.- Appendix: Pourbaix Diagrams.- References.

Additional information

NLS9783642077388
9783642077388
3642077382
Chemical-Mechanical Planarization of Semiconductor Materials by M.R. Oliver
New
Paperback
Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
2010-12-01
428
N/A
Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
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