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Microwave and Millimeter-Wave Electronic Packaging By Rick Sturdivant

Microwave and Millimeter-Wave Electronic Packaging by Rick Sturdivant

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$199.49
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Summary

Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions

Microwave and Millimeter-Wave Electronic Packaging Summary

Microwave and Millimeter-Wave Electronic Packaging by Rick Sturdivant

Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. Without careful attention to these additional issues, it is not possible to successfully engineer electronic packaging at these frequencies. This resource presents the packaging issues which are unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques and how they can be tailored or analysed for higher frequency designs. The book's chapters are organised in logical groups and contain 30 different practical examples.

About Rick Sturdivant

Rick Sturdivant has 23 years of industry experience in the design of modules, packages, and integrated circuits for microwave and millimeter-wave applications. He currently works as a consultant and in business development. He earned his M.S in electrical engineering from UCLA.

Table of Contents

Preface; Introduction; Materials; Ceramic Packaging; Laminate Packaging; First Level Interconnects; Second Level Interconnects; Modules and Motherboards; Transitions and 3D Packaging; Heat Transfer; Electromagnetic Modeling; Conclusions

Additional information

NGR9781608076970
9781608076970
1608076970
Microwave and Millimeter-Wave Electronic Packaging by Rick Sturdivant
New
Hardback
Artech House Publishers
2013-12-31
280
N/A
Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
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