Friction Stir Welding and Processing X by Yuri Hovanski

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Summary

This book is a compilation of the recent progress on friction stir technologies including high-temperature applications, industrial applications, dissimilar alloy/materials, lightweight alloys, simulation, control, characterization, and derivative technologies.

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Friction Stir Welding and Processing X by Yuri Hovanski

This books presents a current look at friction stir welding technology from application to characterization and from modeling to R&D. It is a compilation of the recent progress relating to friction stir technologies including derivative technologies, high-temperature applications, industrial applications, dissimilar alloy/materials, lightweight alloys, simulation, and characterization. With contributions from leaders and experts in industry and academia, this will be a comprehensive source for the field of Friction Stir Welding and Processing.
Mishra, Rajiv S.: - Rajiv S. Mishra is a professor in the Department of Materials Science and Engineering, and Site Director, NSF IUCRC for Friction Stir Processing, at the University of North Texas. Dr. Mishra's publication record includes 255 papers with an h-index of 39. Out of these, 10 of his papers have more than 100 citations. He has many 'firsts' in the field of friction stir welding and processing. He co-authored the first review paper (2005), co-edited the first book on the subject (2007), edited/co-edited seven TMS symposium proceedings, and served as guest editor for Viewpoint Set in Scripta Materialia (2008). He also has three patents in this field. He published the first paper on friction stir processing (2000) as a microstructural modification tool.
SKU Unavailable
ISBN 13 9783030057510
ISBN 10 3030057518
Title Friction Stir Welding and Processing X
Author Yuri Hovanski
Series Minerals Metals And Materials Ser
Condition Unavailable
Binding Type Hardback
Publisher Springer Nature Switzerland AG
Year published 2019-02-12
Number of pages 283
Cover note Book picture is for illustrative purposes only, actual binding, cover or edition may vary.