Chemical-Mechanical Polishing Fundamentals and Challenges: Volume 566

Chemical-Mechanical Polishing Fundamentals and Challenges: Volume 566 by S V Babu

Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the semiconductor industry towards smaller, faster and less expensive interconnects. However, there are still many gaps in the fundamental understanding of the overall CMP process and the associated defect and contamination issues. This book brings together many of the active players in the field to focus on the interdisciplinary nature of these challenges. It reflects, to some extent, the role played by both academic institutions and multinational corporations in opening up the frontiers in the field of CMP for wider dissemination. Both experimental and theoretical contributions are included. Topics include: overview and oxide polishing; pads and related issues; metal polishing - W and Al; copper polishing and related issues; CMP modeling and fluid flow; and particle adhesion and post-polish cleaning.

SKU	Non disponible
ISBN 13	9781558994737
ISBN 10	1558994734
Titre	Chemical-Mechanical Polishing Fundamentals and Challenges: Volume 566
Auteur	S V Babu
Série	Mrs Proceedings
État	Non disponible
Type de reliure	Hardback
Éditeur	Materials Research Society
Année de publication	2000-02-10
Nombre de pages	281
Note de couverture	La photo du livre est présentée à titre d'illustration uniquement. La reliure, la couverture ou l'édition réelle peuvent varier.
Note	Non disponible