Explore Earths Seven Continents by Bobbie Kalman

Explore Earths Seven Continents by Bobbie Kalman

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems - for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deep-trench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads and slurries are presented. Novel polishing methods and are described. Advances in CMP process understanding and modeling are also highlighted.

SKU	Non disponible
ISBN 13	9780778730927
ISBN 10	0778730921
Titre	Explore Earths Seven Continents
Auteur	Bobbie Kalman
Série	Explore The Continents
État	Non disponible
Type de reliure	Paperback
Éditeur	Crabtree Publishing Co,Canada
Année de publication	2010-10-01
Nombre de pages	32
Note de couverture	La photo du livre est présentée à titre d'illustration uniquement. La reliure, la couverture ou l'édition réelle peuvent varier.
Note	Non disponible