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Tin and Solder Plating in the Semiconductor Industry A.C. Tan

Tin and Solder Plating in the Semiconductor Industry By A.C. Tan

Tin and Solder Plating in the Semiconductor Industry by A.C. Tan


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Summary

The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.

Tin and Solder Plating in the Semiconductor Industry Summary

Tin and Solder Plating in the Semiconductor Industry by A.C. Tan

The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.

Table of Contents

Preface. Acknowledgements. Glossary of terms. Introduction. Basic electroplating. Surface preparation for plating. Plating operation. Plating process control. Plating quality assurance. Corrosion. Properties of tin, lead and tin-lead alloy. Tin plating. Tin-lead alloy plating. Plating quality problems. Chemical analysis. Choice of metal finishing. Waste treatment. Improvements and future trends. Index.

Additional information

NPB9780412482403
9780412482403
0412482401
Tin and Solder Plating in the Semiconductor Industry by A.C. Tan
New
Hardback
Chapman and Hall
1992-11-30
326
N/A
Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
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