Advanced Circuits for Emerging Technologies by Krzysztof Iniewski

Advanced Circuits for Emerging Technologies by Krzysztof Iniewski

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Advanced Circuits for Emerging Technologies by Krzysztof Iniewski

The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.

Krzysztof (Kris) Iniewski, PhD, manages R&D developments at Redlen Technologies. He is also an executive director at CMOS Emerging Technologies. A former associate professor in the Electrical Engineering and Computer Engineering and Computer Engineering Department at the University of Alberta, Dr. Iniewski’s Main research interest is in IC design for medical and networking applications.

SKU Unavailable
ISBN 13 9780470900055
ISBN 10 0470900059
Title Advanced Circuits for Emerging Technologies
Author Krzysztof Iniewski
Condition Unavailable
Publisher John Wiley & Sons Inc
Year published 2012-06-12
Number of pages 632
Cover note Book picture is for illustrative purposes only, actual binding, cover or edition may vary.