Chemical-Mechanical Polishing Fundamentals and Challenges: Volume 566

Chemical-Mechanical Polishing Fundamentals and Challenges: Volume 566 by S V Babu

Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the semiconductor industry towards smaller, faster and less expensive interconnects. However, there are still many gaps in the fundamental understanding of the overall CMP process and the associated defect and contamination issues. This book brings together many of the active players in the field to focus on the interdisciplinary nature of these challenges. It reflects, to some extent, the role played by both academic institutions and multinational corporations in opening up the frontiers in the field of CMP for wider dissemination. Both experimental and theoretical contributions are included. Topics include: overview and oxide polishing; pads and related issues; metal polishing - W and Al; copper polishing and related issues; CMP modeling and fluid flow; and particle adhesion and post-polish cleaning.

SKU	Unavailable
ISBN 13	9781558994737
ISBN 10	1558994734
Title	Chemical-Mechanical Polishing Fundamentals and Challenges: Volume 566
Author	S V Babu
Series	Mrs Proceedings
Condition	Unavailable
Binding Type	Hardback
Publisher	Materials Research Society
Year published	2000-02-10
Number of pages	281
Cover note	Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
Note	Unavailable