Advanced Fiber Sensing Technologies by Lei Wei

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Advanced Fiber Sensing Technologies by Lei Wei

Fiber sensing technologies have enabled both fundamental studies and a wide spectrum of applications in every aspect of life. This book highlights the recent advancement in fiber sensing technologies based on newly developed sensing mechanisms, advanced fiber structures, and functional materials. In particular, the integration of functional materials with different electrical, optical, thermal, or mechanical properties into a single fiber offers a wealth of new opportunities in sensing. The book covers the major developments in novel fiber materials, such as semiconductors, metals, polymers, soft glasses, and carbon materials, as well as the sensing applications based on both single fiber and multi-dimensional fiber arrays for temperature, light, strain, vibration, electric and magnetic fields, hazardous chemicals, gases, and physiological signals.
Dr. Lei Wei is an Associate Professor at Nanyang Technological University in Singapore. He received the B.E. degree Wuhan University of Technology in 2005; and the Ph.D. degree from Technical University of Denmark in 2011. Then he joined the Massachusetts Institute of Technology as a postdoctoral associate. In 2014, he joined the School of Electrical and Electronic Engineering at Nanyang Technological University in Singapore as a Nanyang Assistant Professor. In 2019, he was promoted to Associate Professor with tenure. His main research interests are fiber-based devices, multi-functional fibers, bio-fiber interfaces, and in-fiber energy generation and storage. He serves as the Director of Centre for Optical Fibre Technology (COFT) at Nanyang Technological University. He also serves as the Chair of The Optical Society (OSA) Singapore Section and the Executive Committee Member of IEEE Photonics Society Singapore Chapter.
SKU Unavailable
ISBN 13 9789811555060
ISBN 10 9811555060
Title Advanced Fiber Sensing Technologies
Author Lei Wei
Series Progress In Optical Science And Photonics
Condition Unavailable
Binding Type Hardback
Publisher Springer Verlag, Singapore
Year published 2020-07-01
Number of pages 303
Cover note Book picture is for illustrative purposes only, actual binding, cover or edition may vary.