CHIP SCALE PACKAGE, CSP by John H Lau
A guide to chip scale packaging that gives you information on various developments in electronic packaging since surface mount technology (SMT). It features several design techniques, and offers details on more than 40 different types of CSP. It provides engineers and designers a set of tools that they need to solve technical and design issues.
John H. Lau is president of Express Packaging Systems, Inc., and one of the foremost educators on electronic packaging worldwide. He and his company are based in Palo Alto, California. S-W. Ricky Lee is a widely known expert and lecturer on electronic packaging. He is a mechanical engineering faculty member at Hong Kong University of Science and Technology.
| SKU | Unavailable |
| ISBN 13 | 9780070383043 |
| ISBN 10 | 0070383049 |
| Title | CHIP SCALE PACKAGE, CSP |
| Author | John H Lau |
| Condition | Unavailable |
| Binding Type | Hardback |
| Publisher | McGraw-Hill Education - Europe |
| Year published | 1999-02-28 |
| Number of pages | 564 |
| Cover note | Book picture is for illustrative purposes only, actual binding, cover or edition may vary. |
| Note | Unavailable |