Explore Earths Seven Continents by Bobbie Kalman

Explore Earths Seven Continents by Bobbie Kalman

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems - for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deep-trench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads and slurries are presented. Novel polishing methods and are described. Advances in CMP process understanding and modeling are also highlighted.

SKU	Unavailable
ISBN 13	9780778730927
ISBN 10	0778730921
Title	Explore Earths Seven Continents
Author	Bobbie Kalman
Series	Explore The Continents
Condition	Unavailable
Binding Type	Paperback
Publisher	Crabtree Publishing Co,Canada
Year published	2010-10-01
Number of pages	32
Cover note	Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
Note	Unavailable