Integrated Passive Component Technology by Richard K Ulrich

Integrated Passive Component Technology by Richard K Ulrich

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Summary

Presenting survey in Integrated Passive Component Technology, this title describes the processes available for creating integrated passives, measuring their properties, and applying them.

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Integrated Passive Component Technology by Richard K Ulrich

This is a thorough survey of the state-of-the-art in Integrated Passive Component Technology. Describes the processes available for creating integrated passives, measuring their properties, and applying them. Brings reader up to date in a fast-moving technology. Enables reader to implement the technology into a manufacturing environment. Covers existing and potential technologies for various substrate systems such as FR4, ceramic, and HDI. Describes applications favorable to integrated passives and the economic tradeoffs associated with their implementation.
"…a comprehensive look at the reasons and current challenges…[of integrating] passive devices into board or IC…just the right dose of the math to explain the physics and theory behind the technology" (IEEE Circuits & Devices Magazine, Jan/Feb 2005)

"...an interesting and useful book; I wholeheartedly recommend it."(Circuit World, Vol.30, No. 2003)

RICHARD K. ULRICH, PhD, is a professor of Chemical Engineering at the University of Arkansas at Fayetteville. He is a NEMI committee member, a Visiting Associate Editor for IEEE Transactions on Advanced Packaging, and past chair of the Electrochemical Society’s Dielectric Science and Technology Division.

LEONARD W. SCHAPER, Jr., Dr Engr Sc, is a professor of Electrical Engineering at the University of Arkansas in Fayetteville. He is a Fellow of both the IEEE and the International Microelectronics and Packaging Society. He chairs the IEEE CPMT Technical Committee on Discrete and Integral Passives.

SKU Unavailable
ISBN 13 9780471244318
ISBN 10 0471244317
Title Integrated Passive Component Technology
Author Richard K Ulrich
Condition Unavailable
Binding Type Hardback
Publisher Wiley-IEEE Press
Year published 2003-07-11
Number of pages 400
Cover note Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
Note Unavailable