Packaging of High Power Semiconductor Lasers
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Packaging of High Power Semiconductor Lasers by Xingsheng Liu
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular thermal technologies, current applications, and trends in high power semiconductor laser packaging are described at length and assessed.
Dr. Xingsheng Liu, Dr. Wei Zhao, Dr. Lingling Xiong, and Dr. Hui Liu are at the Xi’an Institute of Optics & Precision Mechanics, Chinese Academy of Sciences.
| SKU | Unavailable |
| ISBN 13 | 9781461492627 |
| ISBN 10 | 1461492629 |
| Title | Packaging of High Power Semiconductor Lasers |
| Author | Xingsheng Liu |
| Series | Micro- And Opto-Electronic Materials Structures And Systems |
| Condition | Unavailable |
| Binding Type | Hardback |
| Publisher | Springer-Verlag New York Inc. |
| Year published | 2014-07-15 |
| Number of pages | 402 |
| Cover note | Book picture is for illustrative purposes only, actual binding, cover or edition may vary. |
| Note | Unavailable |