Structural Analysis in Microelectronic and Fiber-Optic Systems
Structural Analysis in Microelectronic and Fiber-Optic Systems
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Structural Analysis in Microelectronic and Fiber-Optic Systems by Ephraim Suhir
This book contains the fundamentals of a discipline, which could be called Structural Analysis in Microelectronics and Fiber Optics. It deals with mechanical behavior of microelectronic and fiber-optic systems and is written in response to the crucial need for a textbook for a first in-depth course on mechanical problems in microelectronics and fiber optics. The emphasis of this book is on electronic and optical packaging problems, and analytical modeling. This book is apparently the first attempt to select, advance, and present those methods of classical structural mechanics which have been or can be applied in various stress-strain problems encountered in high technology engineering and some related areas, such as materials science and solid-state physics. The following major objectives are pursued in Structural Analysis in Microelectronic and Fiber-Optic Systems: Identify structural elements typical for microelectronic and fiber-optic systems and devices, and introduce the student to the basic concepts of the mechanical behavior of microelectronic and fiber-optic struc- tures, subjected to thermally induced or external loading. Select, advance, and present methods for analyzing stresses and deflections developed in microelectronic and fiber-optic structures; demonstrate the effectiveness of the methods and approaches of the classical struc- tural analysis in the diverse mechanical problems of microelectronics and fiber optics; and give students of engineering, as well as practicing engineers and designers, a thorough understanding of the main princi- ples involved in the analytical evaluation of the mechanical behavior of microelectronic and fiber-optic systems.Dr. E. Suhir is on the faculty of the Portland State University, Portland, OR, USA, and Vienna Institute of Technology, Vienna, Austria. He is Life Fellow of the Institute of Electrical and Electronics Engineers (IEEE), the American Society of Mechanical Engineers (ASME), the Society of Optical Engineers (SPIE), and the International Microelectronics Packaging Society (IMAPS); Fellow the Institute of Physics, UK; and the Society of Plastics Engineers (SPE). Ephraim holds 22 US patents and has authored and co-authored above 400 technical publications (papers, book chapters, books, and peer-reviewed conference proceedings), presented numerous keynote and invited talks worldwide, and received many professional awards. Also by Ephraim Suhir
Structural Analysis in Microelectronic and Fiber Optic Systems: Basic Principles of Engineering Elasticity and Fundamentals of Structural Analysis, Van Nostrand Reinhold, New York, 1991
Applied Probability for Engineers and Scientists, McGraw Hill, New York, 1997.
Dynamic Response of Microelectronic Systems to Shocks and Vibrations, John Wiley, New York, 2011 (co-edited with D. Steinberg, and T. Yi)
Reliability of Photonic Materials and Structures, MRS Symposia Proceedings, vol. 531, 1998 (co-edited with M. Fukuda and C. R. Kurkjian) .
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Packaging, Reliability, 2 volumes, Springer, 2008 (co-edited with CP Wong and YC Lee)
| SKU | Unavailable |
| ISBN 13 | 9789401165372 |
| ISBN 10 | 9401165378 |
| Title | Structural Analysis in Microelectronic and Fiber-Optic Systems |
| Author | Ephraim Suhir |
| Condition | Unavailable |
| Binding Type | Paperback |
| Publisher | Springer |
| Year published | 2012-02-17 |
| Number of pages | 418 |
| Cover note | Book picture is for illustrative purposes only, actual binding, cover or edition may vary. |
| Note | Unavailable |