
Advanced Electronic Packaging by Richard K Ulrich
This book updates the book, Advanced Electronic Packaging: With Emphasis on Multichip Modules, Ed.W.D. Brown, IEEE Press, copyright 1999. The original edition of the book has been widely adopted by industry and has been and is still being adopted by universities for graduate courses.-
CMOS
-
Reliability Wearout Mechanisms in Advanced CMOS Technologies
-
Nanometer Frequency Synthesis Beyond the Phase-Locked Loop
-
From Frequency to Time-Average-Frequency
-
Nonvolatile Semiconductor Memory Technology
-
Enhanced Phase-Locked Loop Structures for Power and Energy Applications
-
Quantum Mechanics for Electrical Engineers
-
Nonvolatile Memory Technologies with Emphasis on Flash
-
NAND Flash Memory Technologies
-
Understanding Delta-Sigma Data Converters
..a very nice reference. (IEEE Circuits & Devices Magazine, November/December 2006) ...offers a broad perspective on electronic packaging. (Advanced Packaging Online, August 11, 2006) ...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off. (Chip Scale Review, July 2006) ...useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies. (CircuiTree, May 1, 2006)
Richard K. Ulrich is a professor of chemical engineering at the University of Arkansas. He is a book editor and columnist on embedded passive technology, a NEMI committee member, an associate editor of IEEE Transactions on Advanced Packaging, and past chairman of chairman of the Dielectric Science and Technology Division of the Electrochemical Society.
WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.
| SKU | Unavailable |
| ISBN 13 | 9780471466093 |
| ISBN 10 | 0471466093 |
| Title | Advanced Electronic Packaging |
| Author | Richard K Ulrich |
| Series | Ieee Press Series On Microelectronic Systems |
| Condition | Unavailable |
| Binding Type | Hardback |
| Publisher | Wiley-IEEE Press |
| Year published | 2006-05-23 |
| Number of pages | 848 |
| Cover note | Book picture is for illustrative purposes only, actual binding, cover or edition may vary. |
| Note | Unavailable |









